There are many types of wire connectors out there but these are some of the most common ones you'll encounter.
Abstract: Fuzzy logic Taguchi method (FLTM) is used to optimize parameters for wire bonding process. The proposed FLTM integrates orthogonal arrays, signal-to-noise ratios, response tables, analysis ...
Abstract: The ultrasonic wire bonding has been applied in the semiconductor packaging industry ever since its innovation in the 1960s. The mechanisms of the bonding process, however, are still unclear ...
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