Abstract: Thermal parameters in permanent magnet synchronous machines (PMSMs) often need to be identified or calibrated due to uncertainties arising from manufacturing and assembly processes. This ...
In a new model for user interfaces, agents paint the screen with interactive UI components on demand. Let’s take a look.
Silverback Digital Marketing has announced continued refinement of its mobile app development practices, reflecting the ...
Trango Tech announced an update outlining how mobile applications are increasingly serving as the primary interface for applied artificial intelligence, reflecting a broader shift in how AI ...
NEW YORK, Jan. 6, 2026 /PRNewswire/ -- Visionvast Token, a newly released application introduced by VISIONVAST, has launched ...
Abstract: Open Radio Access Network (O-RAN) is a new approach to mobile networks that disaggregates the network architecture into multi-vendor interoperable physical and software-defined network ...
Consumer demand is driving the need for ever-faster silicon chips, also known as integrated circuits (ICs) or semiconductors.
The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...
3D printed hook and loop fastening system [Source: TU Graz] Researchers at TU Graz have developed a 3D printable “hook and loop” fastener for building components. The researchers sought a way to both ...
This content was written and submitted by the supplier. It has only been modified to comply with this publication’s space and style. EAO, a partner for intuitive and reliable Human Machine Interfaces ...
Renesas Electronics Corporation introduced the RA2L2 microcontroller (MCU) group with ultra-low power consumption and the industry’s first support for the new UCB-C Revision 2.4 standard. Based on a ...
As shown in Figure 1, EV manufacturers apply TIMs at critical thermal interfaces to minimize temperature gradients and prevent overheating. TIMs are placed between cells, modules, and cooling plates ...